Tech Etch Tech Therm thermal gap fillers are dependable heat transfer materials fill air gaps and conduct heat from one heat source to another mating surface or heat sink. When the space existing between two mating surfaces differs due to a variety of conditions, thermal transfer concerns may exist. Tech Etch Tech Therm gap fillers displace the air between these surfaces with highly conductive materials to offer increased cooling.

Tech Therm gap filler solutions are provided in a broad range of thicknesses and formulations and there are adhesive and backing options as well. Thermal gap fillers are a cost-effective solutions for some of the most complex and delicate thermal situations in a wide range of applications.

APPLICATIONS:

  • Heat Sink Interface
  • LED Lighting
  • Integrated Circuits
  • Micro Processors
  • Mobile Electronics
  • Power Conversions

BENEFITS:

  • Custom Shapes
  • Self Tacking
  • Increased Reliability
  • Low Cost
  • Short Lead Times
  • UL 94 V-O Rated
  • Thermal Conductivity

MATERIALS: 

  • Aluminum Oxide Filled Silicone